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Chuck Table Wafer Cutting Disc

  • Chuck Table Wafer Cutting Disc
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    Chuck Table Wafer Cutting Disc

     

    • Commonly used for wafer cutting and cleaning

    • Porous ceramic resistance value: 106~108 ohms

    • Surface grinding accuracy reaches to <5µm

    • 6", 8", 12" inch wafer dicing tray with stainless steel base.

    • High uniformity and high adsorption

     

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