Thin plate carrier tray
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Information
Thin plate carrier tray
• High suction power
• High precision flatness and parallelism grinding
• Porosity 20-25%
• Surface roughness <2.0µm
• Porous ceramics with low resistance and good antistatic properties
• Thickness can be customized according to requirements. Common thickness: 0.7mm, 1.0mm, 2.0mm
• For loading, adsorption, and cleaning of SiC and GaAs wafers
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Q&A