Semiconductor wafer substrate thickness and diameter measuring machine
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Semiconductor wafer substrate thickness and diameter measuring machine
Introduction:
Combine hollow XY axis linear motor positioning stage with laser probe to measure the thickness and warpage of the substrate. It also combines with the image measuring device which can check the outer diameter and detect the flaw of the wafers.
The bottom of the stage is equipped with LIFT PIN, automatic loading and unloading parts, and can be combined with SCARA robotic arm for automatic loading and unloading.Application:
substrate thickness, warpage, outer diameter measurement and flaw detection.
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